Accelicon Technologies, based in Cupertino California, is dedicated to providing innovative EDA solutions to the mixed-signal and RF IC market. Founded in 2002 by noted industry veteran Dr. Xisheng Zhang, the company currently claims over 20 customers worldwide and partnerships with all the leading EDA vendors. Accelicon currently has sales representation in North America, Europe, Taiwan, China, Korea and Singapore.
Accelicon sells the leading SPICE model analysis solution for Model Quality Assurance (MQA) and SPICE model generation software (MBP). MQA provides a critical link between Fab and design, comparing, documenting, and validating foundry-supplied models. Differences between technology nodes, library versions and even other foundry models can be assessed. MBP allows modeling engineer to tweak and optimize SPICE model library in order to best reflect silicon data and meet designer's particular requirement for a specific type of deign. Accelicon also provides SPICE modeling service for various types of devices and process technologies.
Like for SPICE models, comprehensive QA and verification of the Process
Design Kit (PDK) are also required in order to ensure design success.
However, with DFM (Design For Manufacture) considerations, Process
Design Kit (PDK) has become more and more complicated, more procedures
and tools are involved and efforts of verification are tremendous
MBPTM is a one-stop solution that provides both automation and flexibility for device modeling needs. Not only shipped with powerful built-in characterization and modeling capabilities, MBP also provides an open interface for user to customize their own modeling strategy. With the representative of such unique architecture, defined as the Task Tree, user can easily make model extraction process adaptable to specific data and always catch up with the state of the art of modeling methodology.
MQA (Model Quality Assurance) is to automate Model QA procedure and to link advance process technologies and design success.
We offer advanced test structure design for DC, AC and RF modelling, mismatch, interconnect modelling, reliability.