Gradient Design Automation Inc.


Gradient’s HeatWave™ thermal simulator produces a full-chip, three-dimensional temperature profile at device- and interconnect-level resolution. Instance-specific temperatures are annotated into your netlist, giving you thermally-accurate electrical analysis. The designer can pinpoint hotspots and excessive temperature variations—and avoid thermally-induced circuit failures, performance degradations, and reliability issues—before building the chip.




Product Name: HeatWave
Product Category: Power Grid Analysis - ASIC and IC Design

HeatWave™ is an IC thermal simulator for chips, and stacked-die SiP. It computes the full-chip temperature profile at the spatial resolution of your devices and interconnect, and annotates this data into your circuit simulator, making your simulation results temperature-accurate.

Product Name: Modeling Temperature
Product Category: Power Grid Analysis - ASIC and IC Design

HeatWave™ computes the temperature inside the chip or 3D-IC by first building a solid-body heat conduction model of the domain. This thermal model is constructed with adaptive resolution, commensurate with the feature sizes of the power sources and heat conduction paths inside the chip.


Palo Alto
CA 94301
United States
Phone: +1-650-618-6705
Fax: 408-748-3543
Contact us
Url: http://www.gradient-da.com/

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