KLA-Tencor was formed in April 1997 through the merger of KLA Instruments (KLA) and Tencor Instruments (Tencor), two long-time leaders in the semiconductor equipment industry. Prior to the merger, both businesses served a segment of the inspection and metrology area; with KLA focused on defect inspection solutions and Tencor placing its emphasis on metrology solutions. Merging together in a one-to-one stock swap valued at $1.3 billion, KLA-Tencor became the most important process control player in the industry, bringing to market a complete line of yield management products and services from a single company.
Archer AIM targets new standards for lithography process control equipment for 65-nm and beyond. An industry first, Archer AIM leverages a new grating-style technology to significantly reduce the measurement uncertainty associated with traditional overlay metrology for sub-100-nm design rules.
KLA-Tencor, through its ICOS division, offers a series of standalone defect inspectors for various applications in the semiconductor packaging field. Our Component Inspector (CI) products inspect various semiconductor components that are handled in a tray, such as microprocessors or memory chips.
The Candela CS20 wafer inspection system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The automated wafer inspection system's defect detection and inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect wafer surfaces for defects, and film thickness uniformity, of opaque substrates, epi layers, and transparent film coatings (SiC, GaN, sapphire).
KLA-Tencor’s eDR-52xx wafer defect review systems capture high resolution images of wafer defects detected by inspection tools. These images enable defect classification, helping chipmakers to identify systematic defect sources and resolve yield issues. The latest addition to the eDR-52xx series, the eDR-5210S e-beam wafer defect review system, introduces reticle defect review (RDR) and critical point inspection (CPI) modes, furthering the platform’s ability to identify systematic defects from various sources.
KLA-Tencor’s front-end defect inspection tools cover the full range of yield applications within the IC chip manufacturing process, including incoming the wafer qualification process,the reticle qualification process, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection tools find particles, pattern defects and electrical issues on the front surface, back surface and edge of the wafer, allowing engineers to detect and monitor critical yield excursions within the IC chip manufacturing process.
The CI-T120S and -T130S Component Inspection systems are configured for highly accurate metrology, and high-volume 2D bump and 3D bump inspection, of flip-chip substrates. These component inspection systems combine bump inspection, substrate top and bottom surface inspection, and substrate warpage inspection — all in one system. These component inspection systems can measure a wide range of package sizes and features with rapid changeover, making them ideal for quality control on flip-chip substrates.
The LMS IPRO5 mask registration metrology system is designed to ensure that pattern placement on the mask is highly accurate and repeatable, down to the 20nm half-pitch node. At the 20nm node, most critical layers will be manufactured using double patterning lithography (DPL). DPL requires two masks to create one wafer layer, either interweaving the mask patterns or using the second mask to specify cuts in the first mask’s pattern. Triple- or quadruple-mask patterning technology is also being explored.
High Brightness LED (“HB-LED”) usage is increasing for new applications as manufacturing costs decrease and performance improves. HB-LED applications such as mobile phone LCD screens and keypads and flashlights for camera phones have been the drivers for HB-LED wafer manufacturing market growth in the last couple of years, as well as car headlights, LCD TV backlights and traffic signaling.
Product Name: MicroXAM - 100
- ASIC and IC Design
The KLA-Tencor Development Series of 3D surface profilers offer a complete optical surface profilometer and optical interferometer solution focusing on the needs of the engineering and research community. Our 3D surface profiler and optical interferometer products are designed to match the varied requirements of our customers through the delivery of full featured 3D surface profiler and optical interferometer products, integration of new technologies, and improved performance.
KLA-Tencor’s wafer manufacturing tools include wafer inspection, wafer shape quality review, metrology and data management systems. Specialized wafer quality inspection tools assess wafer surface quality and detect, count and bin defects during the wafer manufacturing process and as a critical part of outgoing wafer quality inspection. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography.