Helic, Inc. is a provider of Electronic Design Automation (EDA) software products and services, addressing the semiconductor market and facilitating the design of chips for wireless communications, broadband networking, PCs, tablets and other segments.
VeloceRaptor/X is a breakthrough RLCK extraction tool with unparalleled capacity and speed in the modeling of integrated passives such as transmission lines, interconnects, digital high-speed lines, spiral inductors and metalinsulator-metal (MIM) capacitors.
VeloceRF is a powerful EDA tool bringing for the first time rapid, whole-chip RF modeling and simulation and paving the way to RF Intellectual Property (IP) portability and re-use.
Bondwires are a popular and low-cost assembly option for a wide range of IC packages. In high-speed IC design, bondwires introduce parasitics such as inductance and magnetic coupling which may affect product performance significantly. To meet demanding requirements, IC designers now have the ability to draw, model and optimize bondwires as parts of their circuits.