eASIC® is a fabless semiconductor company offering breakthrough NEW ASIC devices that significantly reduce the overall cost of ownership and time to production of customized silicon devices. Through employing a unique combination of FPGA like logic (look up tables) and a single via for routing, eASIC enables customers to develop NEW ASICs with low up-front costs, and deliver of tested prototypes in only 5 weeks from tape out. The NEW ASIC is offered with a broad portfolio of soft IP including among many others Tensilica Diamond Cores, H.264, DDR2, PCI Express (Gen1 and Gen2), SATA, Fiber Channel and Ethernet MAC.
eASIC Nextreme-2 is a family of NEW ASIC devices, manufactured on a 45nm CMOS process, and built using eASIC’s patented single-via customization technology. The eASIC Nextreme-2 family provides ASIC-like performance, power and low unit-cost combined with FPGA-like design flow and rapid delivery of devices.
The eASIC Nextreme family drastically reduces development cost, and turn-around times compared to standard cell ASICs, while significantly reducing power consumption and unit cost for designs that start off as FPGAs.
The eCores contain custom decode logic that together with the eCell LUTs, can be configured into a dual-port memory. Any rectangular arrangement of eCell™ within the eCore™ can be combined to form an eRAM. Dedicated software tools assist the designer in configuring both a single block of memory and multiple blocks of eRAM memories by connecting the eRAM memories together with additional logic.
easicopy ASIC provides OEMs with a seamless path from a eASIC Nextreme or Nextreme-2 NEW ASIC to a, cell-based, easicopy ASIC thereby enabling OEMs to further reduce device cost and power consumption, or increase performance.