Quik-Pak, originally founded in 1994 as SPT, was purchased by Delphon Industries in 2000. For the last 15 years, Quik-Pak has provided fast turn IC Packaging, Assembly, Prototype and Wafer Processing Services to a wide variety of Semiconductor and Electronics Companies, as well as major Military and Aerospace institutions. Quik-Pak’s customers range from the largest high-tech companies to small startups designing the latest technology. The company offers a Full Turnkey Assembly Solution along with Wafer Dicing, Backgrinding, Die/Wire Bonding, Remolding and Narking/Branding. Custom Assembly services are also offered for Ceramic packages, Chip-on-Board (COB), Stacked Die, and MEMs. Quik-Pak also delivers Advanced Assembly Solutions for Flip Chip Processing, Radiation Detector Manufacturing, and Laser Micromachining. The company utilizes the latest technical innovations to stay ahead of the market and help their customers become industry leaders.