Amkor Technology, Inc.


Amkor is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 300 of the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 6 million square feet of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.




Product Name: CABGA | CTBGA | CVBGA
Product Category: Design for Test - ASIC and IC Design

Amkor’s ChipArray® packages are laminate based Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes.

Product Name: CASON® (ChipArray SON)
Product Category: Design for Test - ASIC and IC Design

Amkor's CASON packages are laminate-based products available as QFN / QFP (Quad Flat No-Lead) packages. These packages typically have single row of package terminals around the perimeter of the package body.

Product Name: CSPnl™ (DSBGA/WLCSP/WCSP/WLP)
Product Category: Design for Test - ASIC and IC Design

Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the acquisition of Unitive®, Amkor has adopted the CSPnl™ as its standard wafer level package offering.

Product Name: ExposedPad LQFP / TQFP
Product Category: Design for Test - ASIC and IC Design

This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP / TQFP can increase heat dissipation by as much as 110% over a standard LQFP / TQFP, thereby expanding the margin of operating parameters.

Product Name: FCmBGA
Product Category: Design for Test - ASIC and IC Design

Amkor’s FCMBGA is the evolution of the SuperFC® high performance flip chip solution. Capillary underfill (CUF) is replaced by molded underfill (MUF).

Product Name: FusionQuad® (VQFP / HVF-PQFP)
Product Category: Design for Test - ASIC and IC Design

Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies.

Product Name: MicroLeadFrame® (MLF)
Product Category: Design for Test - ASIC and IC Design

Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB.

Product Name: PBGA
Product Category: Design for Test - ASIC and IC Design

Amkor's PBGAs incorporate the most advanced assembly processes and designs for today's and tomorrow's cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors.

Product Name: PDIP / SPDIP
Product Category: Design for Test - ASIC and IC Design

Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of 100 mils.

Product Name: PowerSOP® 2 & 3 (PSOP / PSSOP)
Product Category: Design for Test - ASIC and IC Design

This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP (PSOP) improves Theta JA up to 50% over a standard SOIC thereby expanding the margin of operating parameters.

Product Name: PSvfBGA
Product Category: Design for Test - ASIC and IC Design

After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw many new milestones, from publication of JEDEC mechanical and electrical standards to a range of new customers and applications adopting PoP.

Product Name: SOT-23 / SC-70
Product Category: Design for Test - ASIC and IC Design

Amkor’s 1.0 mm thick, 5, 6, and 8 lead SOT23 and 5 and 6 lead SC70 packages offer gullwing lead, sub-miniature, SMT performance characteristics. These packages are high-density leadframe (HDLF) strip-assembled in densities up to 400 units per strip and are processed in an integrated line from die attach through tape and reel for maximum cost effectiveness.

Product Name: Stacked CSP
Product Category: Design for Test - ASIC and IC Design

The Stacked CSP (S-CSP) family utilizes Amkor's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements.

Product Name: SuperFC®
Product Category: Design for Test - ASIC and IC Design

Amkor's SuperFC® is THE high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. This allows the entire die surface to be used for electrical connections to the substrate, exponentially increasing the I / O per unit area vs.

Product Name: TSSOP / MSOP
Product Category: Design for Test - ASIC and IC Design

With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research into assuring quality and reliability with advanced designs, assembly equipment/ processes and materials.


1900 South Price Road
Chandler, AZ 85286
United States
Phone: 480-821-5000
Fax: 480-821-8276
Contact us
Url: http://www.amkor.com


Featured Video
Jobs
Currently No Featured Jobs
Upcoming Events
SRTC-2018 at The Leela Ambience Gurugram NEW DELHI India - Jul 25 - 26, 2018
MPSoC Forum 2018 at The Cliff Lodge 9320 South Cliff Lodge Drive Snowbird UT - Jul 29 - 3, 2018
CDNLive China 2018 at Kerry Hotel Pudong, Shanghai 1388 Hua Mu Road, Pudong Shanghai China - Aug 10, 2018
CDNLive Taiwan 2018 at Ambassador Hotel Hsinchu Taiwan - Aug 14, 2018
DownStream: Solutions for Post Processing PCB Designs
TrueCircuits: IoTPLL



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise