Contract Electronics Manufacturing Services: Kingfield Electronics UK
Kingfield Electronics specialise in providing world class Contract Electronics Manufacturing ( CEM ) solutions to companies operating in a variety of high reliability, high quality, function critical market sectors.
Since 1985 Kingfield Electronics has continued to attract market leading, high expectation customers with a requirement to out-source either all, or a significant part of their product manufacturing requirements. Our core competencies far exceed just manufacturing as we typically provide total product management solutions to organisations with a zero touch manufacturing strategy. This encompasses design, engineering support, global procurement and supply chain management, manufacturing, test, configuration, shipping and field service.
Through hole, or conventional contract PCB assembly represents a key service offering within our range of contract electronic manufacturing services. This capability can be utilised at all levels from the initial production of very low volume, rapid prototype products, through to the ongoing manufacture of complex, multi-technology PCB assemblies. We are capable of producing both RoHS compliant and legacy, leaded product both utilising wave soldering and where necessary hand assembly. Volume conventional PCB assembly services are provided by our partner company in South East Asia.
This activity builds on our box build activity to provide complete manufacturing solutions. Not only are we capable of building individual instruments, but many of our customers applications require the build of multiple instruments, and the configuration of individual units to form systems. These are configured to the individual requirements of each contract or sales order.
Our Surface Mount PCB Assembly capability is a key service offering and supports much of our manufacturing activity. Our in-house facilities permit the manufacture of both leaded and lead-free ( RoHS compliant ) product ( the former is still a significant requirement given the exclusion status of many of our customers ), and we have the ability to place all types of component package including BGA devices. Our processes are heavily automated and we have invested heavily in our manufacturing infrastructure.