Matches: 5
ASIC and IC Design : Yield & Statistical Optimization

Product Name: The latest development MASK MVM-SEM ® of 1Xnm node corresponding "E3640"
Company: Advantest Technology Solutions Corp.

Advantest Corporation (Head Office: Chiyoda-ku, Tokyo, President Matsuno Haruo), can be measured with high precision fine pattern dimensions of the patterned media and mask by using an electron beam scanning technology of its own, the latest MASK MVM-SEM (Multi We will start selling multi-dimensional observation and measurement scanning electron microscope) of "E3640": Vision Metrology Scanning Electron Microscope.

Product Name: Advanced Binary Reticles
Company: Photronics, Inc.

As the semiconductor industry pushes into extremely low k1 processing, and due to the drastic effects of high MEEF lithography, the feature sizes, resolution and CD control required for aggressive optical proximity correction (OPC) have shrunk below 100nm at mask. Advanced binary masks are available from Photronics high end sites, to support production from 130nm to 65nm technology nodes, and for the quickly ramping 45nm node.

Product Name: Large Area Masks
Company: Photronics, Inc.

Photronics operates 2 manufacturing facilities in Asia dedicated to production of Large Area Masks, up to Generation 8 size (2200 x 2500mm), using specialized leading-edge laser patterning equipment.

Product Name: Phase Shift Masks - EAPSM
Company: Photronics, Inc.

EAPSM utilizes a wavelength-tuned, 6% transmission MoSiON absorber to produce a 180 degree phase shift. This improves resolution and depth of focus at the wafer lithography tool.

Product Name: SolidoSTAT
Company: Solido Design Automation Inc.

Process variation costs money. At today’s geometries, statistical effects are diffi cult to design around and cause more and more semiconductor designs to yield badly.

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